‘Never made 50-50 commitment’: Taiwan refuses US demand to make half its chips on US soil; pushes back amid trade row
Taiwan firmly rejected US demands to relocate half its semiconductor production to American soil, with Vice Premier Cheng Li-chiun stating no such commitment was made or would be agreed upon. This pushback occurs amidst ongoing tariff negotiations and Taiwan’s efforts to ease trade tensions by increasing US investments and defense spending, while resisting chip manufacturing pressure.🕒 1 min read
Taiwan firmly rejected US demands to relocate half its semiconductor production to American soil, with Vice Premier Cheng Li-chiun stating no such commitment was made or would be agreed upon. This pushback occurs amidst ongoing tariff negotiations and Taiwan’s efforts to ease trade tensions by increasing US investments and defense spending, while resisting chip manufacturing pressure.
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